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Refurbished equipment, reconfigured for compound-semiconductor fabs.
We reconfigure Canon steppers and KLA CD-SEMs for compound-semi processes across silicon carbide, gallium nitride, gallium arsenide, indium phosphide, sapphire, and quartz.
Why compound-semiconductor processing is different.
Compound semiconductors don't behave like silicon. SiC and GaN carry the power and thermal loads behind EV and grid electronics; GaAs and InP handle the speed and light behind RF and photonics; sapphire and quartz show up as substrates and carriers across all of it. Different materials, different wafer sizes, different handling and equipment that was set up for one doesn't drop into another without work.
That work is the point. A tool configured for 200mm silicon isn't ready for a 100mm SiC process off the shelf. Getting there takes wafer-size adaptation, material-appropriate handling, and metrology qualified for the substrate. It's engineering, not resale — and it's what we do.
The reconfiguration that makes it possible.
For the past 2 decade, we've adapted Canon FPA-3000 steppers and KLA CD-SEMs for compound-semi processes across wafer sizes from 3″ to 8″ and materials including SiC, GaN, GaAs, InP, sapphire, and quartz. That means changing what the tool can physically handle, qualifying it on the new substrate, and testing it to spec on our own line before it ships.
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Compound-semi-capable equipment.
Refurbished Canon FPA-3000 steppers and KLA CD-SEMs, reconfigured for your wafer size and material, rebuilt to OEM spec, and shipped with warranty. Tell us your process and wafer spec, and we'll tell you exactly what it takes.
Demos are equipment-only. See it run before you commit — no obligation.